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YMTC Introduces 128-Layer 1.33Tb QLC 3D NAND
YMTC Introduces 128-Layer 1.33Tb QLC 3D NAND


Wuhan, China, April 13, 2020 - Yangtze Memory Technologies Co., Ltd (YMTC), today announced that its 128-layer 1.33Tb QLC 3D NAND flash memory chip, X2-6070, has passed sample verification on the SSD platform through co-working with multiple controller partners. As the first QLC based 128-layer 3D NAND, X2-6070 has achieved the highest bit density, highest I/O speed and highest capacity so far among all released flash memory parts in the industry①. Accompanying this release, YMTC introduced a 128-layer 512Gb TLC (3 bit/cell) chip, X2-9060, to meet diversified application requirements. ...

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