TMC's Chip Becomes the First Chinese Chip Passing China Unicom's eSIM Platform Test

11/20/2018


A security chip product independently developed by Tongxin Microelectronics (TMC), a subsidiary of Guoxin Micro, has recently passed China Unicom's eSIM management platform test. Proven to be compliant with the eSIM specifications of GSMA, this product can be directly embedded into eSIM terminal devices. This means that TMC is capable of delivering eSIM cards to China Unicom. This chip of TMC becomes the first and the sole Chinese chip that has passed the test so far.


With the development of IoT and NB-IoT technologies, eSIM will play an increasingly important role in future mobile communication services. It will be used for authentication, encryption, and transmission, during which issues of user information security would arise, being a big concern for all businesses in the industrial chain. As a key player in China's IoT eSIM industry, TMC has been participating in the eSIM industrial collaboration initiated by China Unicom since April this year, actively advancing eSIM technology R&D and having released multiple high-performance security chip products.


With the inherent advantages of TMC's chips, this security chip product that has passed China Unicom's test features high performance and reliability and a large capacity. It can save more space for terminals and adapt to more complicated external environments while maintaining a longer service life and data storage cycle, fairly meeting the highly requirements of eSIM on security and reliability. In addition, it supports the new "One Number for  Multi-Device" service, meaning that different smart terminals of a user, including his or her mobile phone, smart watch, and tablet, can all share the same number and tariff package for communication, which is no longer restricted by mobile phones alone. This will accelerate the full application of the new eSIM technology in China and greatly contribute to the share increase of Chinese chips in the global eSIM blue ocean market.


TMC has currently developed a SIM chip product family with wide applications in eSE, SWP-SIM, M2M, and eSIM. Being open and innovative in collaboration, TMC will continue to offer premium products and solutions to partners in the future to satisfy their varied demands in the telecom application market, promote further industrial development in multiple fields, and work with other market players to build a more secure IoT ecosystem.


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