Innovation
Technology
  • Intelligent Module – SeerBlade
    Intelligent Module – SeerBlade

    10/16/2019

    As the flagship product for the next generation of intelligent networks, SeerBlade for the first time equips cloud data center core switches with high-performance AI computing power, making S12500-x the industry's first high-level AI switch product equipped with CPU and GPU....

  • YMTC’s Xtacking? 2.0 Makes Its Debut at IC China 2019
    YMTC’s Xtacking? 2.0 Makes Its Debut at IC China 2019

    10/16/2019

    On September 2nd, 2019, right before IC China 2019 opened in Shanghai, Yangtze Memory Technologies Co., Ltd. (YMTC), a subsidiary owned by Tsinghua Unigroup, announced that it would apply Xtacking? 2.0 in its third-generation 3D NAND flash. Tsinghua Unigroup introduced the technical concept......

  • Security Protection Technology
    Security Protection Technology

    02/26/2019

    Utilizing various sensors and scrambling algorithms, sensitive information on the chips is protected at the same level for financial payments and identification, while performance loss is minimized......

  • UNISOC formulates 5G strategy for global leadership
    UNISOC formulates 5G strategy for global leadership

    02/26/2019

    UNISOC is transforming the mobile communication industry in the 5G era through technological innovation and innovation-driven revolution. Recognizing the strong potential for global industry development, UNISOC will continue to cultivate the 5G market and remain a leading Chinese 5G high-end chipset brand.......

  • Xtacking:New 3D NAND Architecture
    Xtacking:New 3D NAND Architecture

    01/27/2019

    With Xtacking, the periphery circuits which handle data I/O as well as memory cell operations are processed on a separate wafer using the logic technology node that enables the desired I/O speed and functions......

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